This chamber for Denton’s Explorer Deposition System saves 90 min. per cycle with semi-automatic feeding that keeps the main chamber at high vacuum while material is replenished using  the new subsystem. The main chamber remains at vacuum, the finished wafer is extracted, a loadlock valve is closed, and the loadlock is brought to normal pressure. The wafer is then replaced, the system pumped down, and the wafer shuttled into the process chamber. Aluminum delivers low hydrogen, speedy pump down, maneuverability, and even bake out.